RELIFE RL-044 BGA Stencils | Precision CPU Reballing | 0.12mm Thickness | Shehzad Electronics
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₨ 450
- 🟦 Durable Metal Build – Long-lasting and heat-resistant
- 📏 Compact Size – Easy to handle at 8×10 cm
- ⚙️ Precision Cut Holes – Perfect alignment for solder paste
- 🔬 CPU Compatibility – Supports multiple iPhone chipsets
- 🛠️ Professional Repair Tool – Essential for chip-level technicians
- 💡 Clear Labeling – Easy identification of chip layouts
- 🔄 Reusable Design – Withstands repeated reballing cycles
- 🎯 High Accuracy – Ensures consistent soldering results
- 🌍 Trusted Brand – RELIFE & Sunshine quality assurance
- 📦 Complete Packaging – Secure and professional presentation
Achieve flawless soldering and reballing with RELIFE RL-044 BGA Stencils, available at Shehzad Electronics. Designed for precision repair of iPhone CPUs and advanced microchips, these stencils feature multiple grid layouts to match diverse chip configurations. With a thickness of 0.12mm and a compact 8cm × 10cm size, they ensure accurate solder paste application and reliable component placement. Crafted from durable metal, they withstand repeated use while maintaining sharp alignment. Whether for professional repair shops or DIY enthusiasts, these stencils deliver efficiency, accuracy, and consistency in microelectronics work. Trusted worldwide, RELIFE stencils are the ultimate tool for modern chip-level repair.
⚙️ Specifications
- Brand: RELIFE / Sunshine Tools
- Model: RL-044 IPZ16 / IP216
- Thickness: 0.12mm
- Size: 8cm × 10cm
- Material: High-quality metal stencil
- Compatibility: iPhone CPUs (IP17/Pro/Max/Air/A18/A19/A19Pro, P7-A13/A15/Pro)
- Application: BGA soldering & reballing
- Packaging: Precision BGA Stencil set
- Supplier: Shehzad Electronics
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