Solder sucker Desoldering Vacuum Pump

 165

In stock

  • Metal Body, High Suction Power, Light Weight
  • Ideal for all types of repairing
  • All metal construction is ideal for heavy use including production re-work and repair.
  • Providing safe, low cost means of desoldering connections, PC boards and components.
  • Large capacity spring-loaded plunger quickly removes solder in a single action. Tool easily disassembles for fast
  • cleaning, tip and “O” ring replacement. Internal plunger pin automatically purges solder from tip with each use.
  • Powerful suction for solder removal
  • Easy one-handed use
TheΒ UltimateΒ ToolΒ forΒ Clean,Β PrecisionΒ Desoldering!

EfficiencyΒ meetsΒ durabilityΒ withΒ theΒ AluminumΒ SolderΒ Sucker,Β anΒ essentialΒ instrumentΒ forΒ anyΒ seriousΒ electronicsΒ repairΒ orΒ DIYΒ project.Β ThisΒ high-powerΒ vacuumΒ pumpΒ isΒ engineeredΒ toΒ removeΒ moltenΒ solderΒ withΒ aΒ singleΒ click,Β ensuringΒ yourΒ circuitΒ boardsΒ remainΒ cleanΒ andΒ undamagedΒ duringΒ componentΒ removal.Β CraftedΒ withΒ aΒ ruggedΒ aluminumΒ bodyΒ andΒ aΒ specializedΒ anti-slipΒ knurledΒ grip,Β itΒ providesΒ maximumΒ controlΒ andΒ comfortΒ forΒ repetitiveΒ tasks.Β WhetherΒ youΒ areΒ aΒ professionalΒ technicianΒ orΒ aΒ hobbyist,Β thisΒ 19cmΒ precisionΒ toolΒ makesΒ desolderingΒ fast,Β safe,Β andΒ incrediblyΒ simple.

πŸ“ŠΒ TechnicalΒ Specifications

ComponentΒ /Β Parameter SpecificationΒ Detail
ToolΒ Name AluminumΒ SolderΒ SuckerΒ /Β DesolderingΒ VacuumΒ Pump
TotalΒ Length 19cm
BodyΒ Material High-GradeΒ Aluminum
GripΒ Type ErgonomicΒ Anti-slip
OperationΒ Type ManualΒ PistonΒ withΒ SuctionΒ &Β UnlockΒ Buttons
Application SolderΒ RemovalΒ /Β PCBΒ RepairΒ /Β DIYΒ Electronics

 


πŸ› οΈΒ QuickΒ UsageΒ Guide

  1. Prime:Β PushΒ theΒ suctionΒ buttonΒ downΒ untilΒ itΒ clicksΒ intoΒ place.
  2. Melt:Β HeatΒ theΒ solderΒ jointΒ withΒ yourΒ ironΒ untilΒ itΒ isΒ fullyΒ liquid.
  3. Vacuum:Β PlaceΒ theΒ nozzleΒ againstΒ theΒ solderΒ andΒ pressΒ theΒ unlockΒ buttonΒ toΒ suckΒ upΒ theΒ waste.
  4. Repeat:Β IfΒ needed,Β repeatΒ theΒ processΒ untilΒ theΒ padΒ isΒ completelyΒ clean.

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